Solder

Last updated: August 2020

Reason of failed review:

A: The Space between IC pads should be at least 0.2mm if solder mask bridge for green soldermask needed of 1oz/2oz/3oz copper board.

B: Space between IC is smaller than 0.22mm, we can not do solder mask bridge for blue/red/white/yellow/black/matte black solder mask of 1oz/2oz/3oz copper.

C: For 3oz ~10oz copper, if solder mask bridge is needed, IC pad width and IC pad spacing should be ≥ trace width and trace spacing corresponding to copper thickness. For example, for 3oz copper thickness board, trace width/spacing should be ≥ 0.25mm/0.23MM. Then IC pad spacing should be at least 0.23mm, so that solder mask bridge is available.

Suggestion:

A: Modify the space between IC pads to reach our standard.

B: Just do as your file and accept no soldermask bridge between IC pads.

To ensure quality, the following content is no longer available and outdated.

We can only give a limited recommendation for coating vias (plated-through holes) with solder-stop. Please refer to our Design Aid Via Covering.

You should pay special attention to solder-stop bridges (solder-stop between two pads or vias), which should not be smaller than 100μm (green solder-stop) and 150μm (coloured solder-stop) respectively.

Solder-stop parameters (colour: green)

Solder-stop parameters (colour: red, blue, white, black)

Exemption of component holes

For component holes, please ensure a clearance (spacing between copper to solder-stop) of at least 50μm (green solder-stop).

This clearance should be larger if possible (75μm), to avoid manufacture with extreme tolerances.

For other colours, the minimum solder-stop clearance is 75μm.

The smallest possible solder-stop bridge width is 100μm (green) or 150μm (other colours), respectively.

Exemption of SMD pads (fine pitch)

The minimum solder-stop clearance for SMD pads should at least be 50μm, better: 75μm.

For other colours than green, the min. solder-stop clearance is 75μm.

The smallest possible solder-stop bridge width is 100μm (green) or 150μm (other colours), respectively.

BGA (Ball Grid Array)

The following possibilities exist for BGAs (for explanation see Via Covering):

■Via Tenting

■Via Filling

■Via-in-Pad

You should consult your assembly partner when selecting an appropriate surface, normally our customers select immersion tin or immersion gold.

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